Hong Kong SAR, China, May 2008 Call for Papers Important Dates Committees Paper Submission Advance Program Registration Events

The First ACM International Workshop on Integrated Heterogeneous Sensor Networks HeterSenet 2008 Hong Kong SAR, China, May 30, 2008 (co-located with ACM MobiHoc) Call for Papers Recent years have witnessed an increasing trend of integration of sensor networks with existing infrastructure networks like wired networks and wireless local/wide-area networks. Such integration provides several key technical advantages including significant improvement of sensor networks' capacity/coverage, ubiquitous access of physical information and involvement of people (e.g., mobile phone users) in the process of information gathering and sharing. As a result, a range of new context and location-aware pervasive computing applications will be enabled. The workshop seeks to provide a forum for the presentation of research results on the integration of sensor networks with existing infrastructure networks like wired networks, and wireless local/wide-area networks. A heterogeneous network environment is typically composed of terminals with different capacities such as sensors, actuators, mobile devices (PDAs and mobile phones), and Internet hosts. Seamlessly integration of these terminals requires innovative network architectures, data services, and communication protocols. In urban environments, mobile phones can be used as sensors to collect image, audio, video and location information. New business models and incentives should be sought to allow mobile phone users to participate in the creation and provision of sensor based services. The workshop will cover data link, network and transport layers, as well as application, data services and middleware, security, power management issues in integrated heterogeneous networks, including sensors and actuators, local area, vehicular, personal, and wide-area networks. Possible topics of interests include, but are not limited to: • integration of sensor networks with the future Internet architecture • network support for creation and deployment of sensor based services • interconnection between sensor networks and 3G networks • multimedia (audio/video) sensor networks • delay-tolerant sensor networks • sensor database systems and operating systems • addressing, position determination, service and location discovery • sensor area coverage, data-centric operations • data communication, routing and broadcasting protocols • traffic engineering and multimedia, Quality of Service (QoS) • resource management and scheduling • application of RFID in sensor networks • security for integrated and heterogeneous sensor network systems • performance evaluation, testbeds, modeling and simulation. Important Dates Submission deadline (extended): March. 6, 2008 Acceptance notification: March 20, 2008 Workshop: May 30, 2008 Submission Details Papers should be submitted in PDF format via email. Submissions must be correctly formatted to fit on no more than 8 U.S. "Letter" pages (8.5 inches wide by 11 inches tall). The margin is at least 1 inch on all edges (top, bottom, left, and right) of each page. The size of font should be at least 10 point. Organization Committee General Chair: Weijia Jia (City University of Hong Kong) Program Co-Chair: Pedro M. Ruiz (University of Murcia, Spain) Program Co-Chair: Guoliang Xing (City University of Hong Kong) Program Co-Chair: Srdjan Krco (Ericsson Ireland) Technical Program Committee Chun Tung Chou, University of New South Wales Marco Conti, Istituto di Informatica e Telematica, CNR Sajal Das, University of Texas at Arlington Mischa Dohler, France Telecom Silvia Giordano, University of Applied Science SUPSI Alexandar Gluhak, Ericsson Ireland Research Centre Qingfeng Huang, PARC Inc. Raja Jurdak, UCD Ireland Thomas Kunz, Carleton University Miguel A. Labrador, Univ. of South Florida Benyuan Liu, University of Massachusetts Lowell Hai Liu, Univ. of Ottawa Cormac Sreenan, University College Cork Sotiris Nikoletseas, CTI Patras, Greece Dirk Pesch, CIT Cork Neeli Prasad, Aalborg University Dan Wang, HK Polytechnic Univ. Jianping Wang, City Univ. of HK Jie Wu, Florida Atlantic University Juan A. Sanchez, Univ. of Murcia Leo Selavo, University of Latvia John Stankovic, University of Virginia David Symplot, Univ. of Murcia Vlasios Tsiatsis, Ericsson Research Sweden Gang Zhou, College of William and Marry